Author(s): Jia, L (Jia, Lu); Han, GW (Han, Guowei); Wei, ZY (Wei, Zhenyu); Si, CW (Si, Chaowei); Ning, J (Ning, Jin); Yang, FH (Yang, Fuhua); Han, WH (Han, Weihua)

Source: MICROMACHINES Volume: 13 Issue: 11 Article Number: 1967 DOI: 10.3390/mi13111967 Published: NOV 2022

Abstract: A novel three-dimensional (3D) wafer-level sandwich packaging technology is here applied in the dual mass MEMS butterfly vibratory gyroscope (BFVG) to achieve ultra-high Q factor. A GIS (glass in silicon) composite substrate with glass as the main body and low-resistance silicon column as the vertical lead is processed by glass reflow technology, which effectively avoids air leakage caused by thermal stress mismatch. Sputter getter material is used on the glass cap to further improve the vacuum degree. The Silicon-On-Insulator (SOI) gyroscope structure is sandwiched between the composite substrate and glass cap to realize vertical electrical interconnection by high-vacuum anodic bonding. The Q factors of drive and sense modes in BFVG measured by the self-developed double closed-loop circuit system are significantly improved to 8.628 times and 2.779 times higher than those of the traditional ceramic shell package. The experimental results of the processed gyroscope also demonstrate a high resolution of 0.1 degrees/s, the scale factor of 1.302 mV/(degrees/s), and nonlinearity of 558 ppm in the full-scale range of +/- 1800 degrees/s. By calculating the Allen variance, we obtained the angular random walk (ARW) of 1.281 degrees/root h and low bias instability (BI) of 9.789 degrees/h. The process error makes the actual drive and sense frequency of the gyroscope deviate by 8.989% and 5.367% compared with the simulation.

Accession Number: WOS:000895309300001

PubMed ID: 36422395

eISSN: 2072-666X

Full Text: https://www.mdpi.com/2072-666X/13/11/1967