Terahertz cavity optomechanics using a topological nanophononic superlattice
Author(s): Chang, HN (Chang, Haonan); Li, ZY (Li, Zhenyao); Lou, WK (Lou, Wenkai); Yao, QF (Yao, Qifeng); Lai, JM (Lai, Jia-Min); Liu, B (Liu, Bing); Ni, HQ (Ni, Haiqiao); Niu, ZC (Niu, Zhichuan); Chang, K (Chang, Kai); Zhang, J (Zhang, Jun)
Source: NANOSCALE DOI: 10.1039/d2nr03376c Early Access Date: AUG 2022
Abstract: Cavity optomechanical systems operating at the quantum ground state provide a novel way for the ultrasensitive measurement of mass and displacement and provide a new toolbox for emerging quantum information technologies. The high-frequency optomechanical devices could reach the quantum ground state at a high temperature because the access to high frequency is favorable for the cavity optomechanical devices to decouple from the thermal environment. However, reaching ultra-high frequency (THz) is extremely difficult due to the structure of cavity optomechanical devices and properties of materials. In this paper, by introducing acoustic topological interface states, we designed a THz mechanical frequency semiconductor pillar microcavity optomechanical device based on a GaAs/AlAs nanophononic superlattice. In the optomechanical system, multi-optical cavity modes are obtained and the frequency separation between adjacent optical modes is equal to the frequency of the mechanical mode (optomechanical frequency matching). By detuning the laser pump to a lower (higher) energy-resolved sideband to make a spontaneously scattering photon doubly resonate with optical cavity modes at an anti-Stokes (Stokes) frequency and pump frequency, we can achieve an anti-Stokes (Stokes) scattering efficiency 2600 (1800) times larger than that of Stokes (anti-Stokes) scattering, which provides potential for laser cooling and low threshold phonon lasing in the optomechanical system.
Accession Number: WOS:000849189500001
PubMed ID: 36056707
Author Identifiers:
Author Web of Science ResearcherID ORCID Number
Zhang, Jun 0000-0002-9831-6796
ISSN: 2040-3364
eISSN: 2040-3372
Full Text: https://pubs.rsc.org/en/content/articlelanding/2022/NR/D2NR03376C