Author(s): Wang, MJ (Wang, Mingjin); Liu, WZ (Liu, Wenzhen); Xu, YB (Xu, Yuanbo); Fu, T (Fu, Ting); Chen, JX (Chen, Jingxuan); Zheng, WH (Zheng, Wanhua)

Source: OPTICS LETTERS Volume: 47 Issue: 7 Pages: 1709-1712 DOI: 10.1364/OL.446924 Published: APR 1 2022

Abstract: A single-chip hybrid integrated silicon photonics transmitter based on passive alignment flip-chip bonding technology has been demonstrated. The transmitter is developed by the hybrid integration of a C-band slotted laser with 1mm cavity length and a Mach-Zehnder modulator with 2mm long phase shifter. A 3 dB bandwidth of the small signal response is 16.35 GHz at 5.99 VPP superimposed with a reverse bias voltage of 2.43V. A 25 Gbps data transmission experiment of the hybrid integrated transmitter is performed at 25 degrees C. (C) 2022 Optica Publishing Group

Accession Number: WOS:000778798800036

PubMed ID: 35363714

ISSN: 0146-9592

eISSN: 1539-4794

Full Text: https://opg.optica.org/ol/fulltext.cfm?uri=ol-47-7-1709&id=470805