Author(s): Li, SY (Li, Shao-Yang); Wang, LL (Wang, Liang-Liang); Wu, D (Wu, Dan); You, J (You, Jin); Wang, Y (Wang, Yue); Zhang, JS (Zhang, Jia-Shun); Yin, XJ (Yin, Xiao-Jie); An, JM (An, Jun-Ming); Wu, YD (Wu, Yuan-Da)

Source: CHINESE PHYSICS B Volume: 31 Issue: 2 Article Number: 024203 DOI: 10.1088/1674-1056/ac0dac Published: FEB 1 2022

Abstract: Since the advent of three-dimensional photonic integrated circuits, the realization of efficient and compact optical interconnection between layers has become an important development direction. A vertical interlayer coupler between two silicon layers is presented in this paper. The coupling principle of the directional coupler is analyzed, and the traditional method of using a pair of vertically overlapping inverse taper structures is improved. For the coupling of two rectangular waveguide layers, a pair of nonlinear tapers with offset along the transmission direction is demonstrated. For the coupling of two ridge waveguide layers, a nonlinear taper in each layer is used to achieve high coupling efficiency. The simulation results show that the coupling efficiency of the two structures can reach more than 90% in a wavelength range from 1500 nm to 1650 nm. Moreover, the crosstalk is reduced to less than -50 dB by using multimode waveguides at intersections. The vertical interlayer coupler with a nonlinear taper is expected to realize the miniaturization and dense integration of photonic integrated chips.

Accession Number: WOS:000749826200001

ISSN: 1674-1056

eISSN: 2058-3834

Full Text: https://iopscience.iop.org/article/10.1088/1674-1056/ac0dac