Author(s): Wu, XL (Wu, Xulei); Wang, HT (Wang, Huatao); Wang, Z (Wang, Ziao); Xu, JL (Xu, Jinglong); Wu, YJ (Wu, Yajin); Xue, R (Xue, Rui); Cui, HX (Cui, Hongxin); Tian, C (Tian, Cong); Wang, Y (Wang, Yu); Huang, XX (Huang, Xiaoxiao); Zhong, B (Zhong, Bo)

Source: CARBON Volume: 182 Pages: 445-453 DOI: 10.1016/j.carbon.2021.06.048 Published: SEP 2021

Abstract: Thermal interface materials (TIMs) play a crucial role in enhancing the reliability and sustainable utili-zation of next-generation electronics and thus can help meet the increasing demand for multifunctional devices with higher performance. Herein, we introduce a method for creating a TIM with high cross-plane thermal conductivity based on graphite nanoplatelet (GNP)/polyurethane (PU) films. The graphite nanoplatelets ensured the heat transfer properties of the TIM. Moreover, the hot-pressing procedure improved the thermal conductivity to 26.3 W (m K)(-1) with the improved orientation of the GNPs in the PU matrix, as confirmed by microscopy investigation. Under a thermal dissipation power of 10-20 W, a drastic reduction in the chip temperature (17.5-42.3 degrees C) was achieved using our oriented GNP/PU TIM compared to a commercial silicone TIM (5.0 W (m K)(-1)). In addition, as-prepared pads can be mass produced at an acceptable cost, indicating that our work provides a promising new approach to fabricating TIMs for application in the next-generation thermal management of high power density electronics. (C) 2021 Elsevier Ltd. All rights reserved.

Accession Number: WOS:000684297200013

ISSN: 0008-6223

eISSN: 1873-3891

Full Text: https://www.sciencedirect.com/science/article/pii/S0008622321006357?via%3Dihub