Stability characterization of vacuum encapsulated MEMS resonators with Au-Sn solder bonding
2018-09-07
Stability characterization of vacuum encapsulated MEMS resonators with Au-Sn solder bonding
Authors: Zhao, JC; Yuan, Q; Sun, HY; Yang, JL; Sun, L
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS
Volume: 24 Issue: 9 Pages: 3885-3892 Published: SEP 2018 Document type: Article
DOI: 10.1007/s00542-018-3888-0
全文链接:https://link.springer.com/article/10.1007/s00542-018-3888-0