报告题目：More than Moore (MtM) and Chips for Smart Grid 

　　报告人：姜学平博士，国家电网公司国网智能电网研究院 

　　  时间：2013年7月1日（星期一）下午15:00 

地点：半导体所新建研发楼（5号楼）4层LED大会议室

　　Abstract: In the first part of this talk, we give an overview of the business and technical factors defining the More than Moore (MtM) movement, and address how it will yield revolutionary electronic devices. Moore's law has transcended computing expectation. Its promise will eventually reach scalability limitation. Future technology encompasses breakthroughs capable of interaction with the outside world, which the MtM movement achieves. Instead of scaling down, integrating functionalities delivers cost-optimized and value-added system solutions. This trend holds significant potential for the industry. After briefly introducing smart grid in the second part of this talk, we focus on our research and development efforts on chip for smart grid. The topics cover new generation system-on-chip (SoC) with smart grid application, new generation monolithic Hall effect sensor integrated in smart metering systems, energy harvesting wireless network with temperature sensor, and online monitoring of transformer winding deformation using scanning frequency response analysis (SFRA) method. MtM makes the implementation of system solutions with these new chips feasible.  

　　简历：姜学平，博士，现任国家电网公司国网智能电网研究院副总工程师。回国前长期在硅谷的半导体企业担任技术负责人，具有丰富的产品研发和项目管理经验。曾领导研发过大型通用计算机芯片、现场可编程逻辑门阵列（FPGA）芯片、专用通信芯片等多种芯片。姜学平博士于2012年入职国家电网公司，组建了国家电网公司的智能芯片研发团队。目前研发的产品包括传感器信号采集芯片、交流电电能计量芯片、电力通信芯片、安全芯片、数字信号处理芯片等。产品可广泛应用于智能变电站、智能输配电、用电自动化、智能家居、智能楼宇、智能电力通信、智能电表、电力物联网等领域。