报告题目:The Impact of Design-on-Simulation Technology on Mcroelectronics Product Design Procedure

报告人:江国宁教授(台湾高速网路与计算中心)

时间: 2012年09月18日(星期二) 下午 14:00

地点: 中国科学院半导体研究所学术会议中心

报告人简介： Professor Chiang is the Editor-in-Chief of IEEE Transactions on Components, Packaging and Manufacturing Technology, and he was the associate editor of 4 SCI Journals, IEEE Transactions, Components and Packaging Technologies as well as Advanced Packaging, ASME Transactions – Journal of Electronic Packaging and Journal of Mechanics. His vision and research performance drives to establish a “Design on Simulation (DOS)” based development procedure for advanced packaging products such as WLCSP and 3D packages, he is a well-known scholar in this research and application field. Professor Chiang has collaborated with many electronic packaging house, semiconductor and LED companies such as ACET, tsmc, UMC, EPISTAR (LED), VIA, etc. Between 2006-2012, professor Chiang was the Chairman of Taiwan Microelectronics and Packaging Society and also President of IMAPS – Taiwan. Currently, he is the director of Advanced Packaging Research Center, National Tsing Hua University and also the director general of National Center for High-Performance Computing (NCHC) which is a national strategic research center of Taiwan.

报告人简介： Professor Chiang is the Editor-in-Chief of IEEE Transactions on Components, Packaging and Manufacturing Technology, and he was the associate editor of 4 SCI Journals, IEEE Transactions, Components and Packaging Technologies as well as Advanced Packaging, ASME Transactions – Journal of Electronic Packaging and Journal of Mechanics. His vision and research performance drives to establish a “Design on Simulation (DOS)” based development procedure for advanced packaging products such as WLCSP and 3D packages, he is a well-known scholar in this research and application field. Professor Chiang has collaborated with many electronic packaging house, semiconductor and LED companies such as ACET, tsmc, UMC, EPISTAR (LED), VIA, etc. Between 2006-2012, professor Chiang was the Chairman of Taiwan Microelectronics and Packaging Society and also President of IMAPS – Taiwan. Currently, he is the director of Advanced Packaging Research Center, National Tsing Hua University and also the director general of National Center for High-Performance Computing (NCHC) which is a national strategic research center of Taiwan.