香港城市大学的Paul K Chu教授将于10月17日来我所学术交流，并在“黄昆半导体科学技术论坛”上作第83期讲座。欢迎广大科研人员及研究生积极参加。

报告题目: Plasma-Based Technology in Microelectronics, Nanotechnology, and Biomedical Engineering

报告时间: 2008年10月17日(星期五) 上午 9:30

报告地点: 中国科学院半导体研究所学术会议中心

报告人: Prof. Paul K Chu (City University of Hong Kong)

Abstract:Plasma-based ion implantation and deposition are useful techniques in many applications. In this seminar, recent research works conducted in our laboratory pertaining to microelectronics, nanomaterials, and biomedical engineering will be described. Silicon-on-insulator (SOI) is expected to replace conventional bulk silicon substrates in many microelectronic devices. By using hydrogen plasma immersion ion implantation in conjunction with layer transfer technology, we have produced the first 100 and 150mm full SOI wafers using plasma technology.As device dimensions continue to shrink, wider applications of SOI in microelectronics are hampered by the self-heating effects caused by the poor thermal conductivity of the buried silicon dioxide layer. We have produced alternative buried insulators such as diamond-like carbon that possess better thermal conductivity compared to conventional silicon dioxide using plasma immersion ion implantation and deposition and successfully fabricated SOI structures with improved thermal stability. High-k materials are important in deep sub-micrometer CMOS technology. We have fabricated different types of high-k thin films and improved the crystallization as well as interfacial properties. Besides, our recent work on nanobiology, particularly biolabeling using silicon carbide nanocrystals, will be described.

报告人简介：Paul K Chu is Professor (Chair) in the Department of Physics and Materials Science in City University of Hong Kong. He received his MS and PhD in chemistry from Cornell University. His research activities are quite diverse including microelectronic, optoelectronic, and biomedical materials. Paul is Fellow of the APS, AVS, IEEE, and HKIE. He has won many awards including the 2007 IEEE Nuclear and Plasma Sciences Society Merit Award. Paul is co-editor of 3 books and has written 20 book chapters and more than 600 journal papers. Paul has been awarded 8 US and 5 Chinese patents, which have been cited more than 50 times by IBM, Samsung, LSI Logic, Applied Materials, and so on in their patent applications. He is credited by ISI Thomson Scientific as one of the top 0.1% scientists in materials science. He is senior editor of IEEE Transactions on Plasma Science, associate editor of International Journal of Plasma Science and Engineering and Materials Science and Engineering Reports. He holds concurrent professorship in 12 universities and research institutes in China.

联系人：徐艳坤

联系电话：82304453